PeakView® Electromagnetic Design Platform
PeakView® Solutions
3D EM signoff is the only way to assure EM accuracy due to the 3D nature of process/packaging and high-frequency EM behavior, making PeakView® the EM golden data for advanced process nodes.
Our state-of-the-art simulation engine is designed to efficiently analyze the complex structures found in modern semiconductor technology. Users have access to two high-performance EM solvers (FlatLEM and HCS), dedicated to different applications while maintaining the same level of accuracy.
PeakView® is at the forefront of the AI revolution by providing the necessary tools to develop the chips for the latest technology requirements. With PeakView®, users have access to powerful EM analysis tools for manufacturing with confidence: 3D mesh and EM parameter visualizations, post-processing capabilities, etc.
IC, 3DIC, and Packaging Solutions
Peakview® supports multi-level IC/3DIC/Interposer/Packaging EM co simulations for an integrated 3D fullwave EM simulation and analysis of multi-level IC, 3DIC and packaging structures with arbitrary combinations and unlimited layers. A typical application is HBM+WoW+CoWoS+Packaging with all the TSV and bumps.
PeakView® provides a seamless workflow for the most demanding silicon photonics, from the design and optimization of advanced photonics layouts to the fullwave 3D EM simulations and equivalent circuit model generation. Traditional flows require multiple external tools, but PeakView® satisfy all these needs within the same tool.
EM Isolation Analysis with PeakView®
The EM isolation noise floor defines the lowest coupling value that EM tools can capture without losing numerical accuracy or physical meaning. PeakView® achieves up to -130dB as the maximum EM isolation noise floor.
PeakView®-based Rapid Silicon Characterization approach provides a fast turnaround based on fullwave EM simulations allowing users to de-embed their measurements and verify the reliability of the process technology information.