Silicon measurement has been a reliable reference to develop valid models for circuit simulations. However, high-frequency silicon characterization requires specialized measurement equipment, calibration methods, design of test structures, and engineering expertise that complicates the generation of solid measurement-based models. Large-scale EM simulations have emerged as an alternative to the lack of high-frequency silicon data, but reliable EM simulations bring additional challenges. EM models require solver engines with fullwave capabilities, 3D accuracy, and broad-band accuracy (DC-TeraHz).
PeakView®’s 3D Fullwave EM Simulations Vs Silicon Measurements
- PeakView®’s 3D fullwave EM simulation results deliver excellent correlation with silicon measurements from differential transmission lines of lengths of 1mm and 2mm in a GSGSG configuration.
- While silicon measurements are limited to 67 GHz, PeakView®’s EM simulations extended to 150 GHz, highlighting the strength of large-scale EM simulation.
- Conventionally, 2.5D solvers have been used to characterize and design passives; however, their accuracy degrades at higher frequencies as illustrated in the comparison below. (From OIP2025)
- The illustration below compares PeakView®’s EM simulation and measurements of long transmission lines including the effects of measurement pads and interconnects, where 3D accuracy show superior performance compared to 2.5D results.
- While 3D EM simulations showed better correlation with raw measurement results, reliable de-embedding methods are needed for a direct comparison of the transmission line alone as DUT.
PeakView®’s 3D EM-based De-embedding Framework
PeakView® provides a consolidated 3D EM-based de-embedding framework that integrates measurements and fullwave 3D EM simulation of test structures and device-under-tests (DUTs) for a direct comparison with silicon data. PeakView®’s framework represents a more efficient flow, where designers can further validate the reliability of the foundry process technology information as well as the quality of the test structures before fabrication. This methodology has been verified using silicon measurement data, showing excellent agreement over a broad frequency range extending into the sub-THz domain.
Specialized De-Embedding Algorithms for Transmission Lines
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- PeakView® includes extensive scripting capabilities allowing the implementation of new algorithms such as the cascade method to enable the silicon characterization of long transmission lines at extremely high frequencies and enable the most demanding silicon photonic needs.
- PeakView®’s patented de-embedding method for transmission lines exploits the simplicity of transmission line design as it requires the simplest de-embedding test keys represented by only two identical transmission lines of arbitrary ratio between them.
- PeakView®’s 3D EM accuracy is imperative to deliver EM simulation results that includes all EM effects associated with high-frequency operation such as skin effect, proximity effect, etc, which allows the close correlation with silicon data.
- The de-embedded results from PeakView®‘s 3D EM simulations show excellent correlation with de-embedded measurements, confirming PeakView®‘s reliable accuracy. (From OIP2025)
- Large-scale 3D EM simulations enable validation of de-embedding algorithms for specific devices and operating frequencies. De-embedded results from PeakView®’s patent-pending cascade method show better correlation with simulation references compared to conventional TRL techniques.
THREE-Step De-embedding Methods
PeakView®’s de-embedding framework also includes methods based on one, two and three standards (open, short, and thru). PeakView®’s de-embedding study based on EM simulation provides the “as is” simulation capability to electromagnetically simulate the entire de-embedding structures and devices. With the EM simulation data, multiple de-embedding strategies are studied:
- The system error introduced in de-embedding algorithms is quantified.
- Potential flaws in the test structures are captured earlier without silicon cost and time lost.
- EM simulation of multiple test-structures leads to the fabrication of better designs leading to more efficient silicon characterization.
- Automation of test structure generation can be realized based on PeakView®’s EM design
References
- OIP2025 Large-Scale 3D Terahertz EM Design and Signoff for 3DIC-Based Silicon Photonics with Silicon Case Studies
- Lorentz Solution, Inc. Accurate Cascade De-Embedding Method for RF, MMwave and Photonics Transmission Lines. U.S. Patent Pending.
- LD20729 3D Fullwave EM Synthesis Optimization and Sign-off for the New Silicon Photonics Time
- LD16217_PeakView De-embedding Feature
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