Lorentz Solution™ Inc. is the first organization to envision and develop an EM design and verification platform with integrated EM solver in the IC design environment. Lorentz™ is also proud to be first company to achieve the ultimate EM simulation accuracy up to TeraHz frequencies by making 3D formulation and simulation feasible with Method of Moments-like algorithm. As process nodes have evolved, Lorentz™ has continuously enhanced its EM design platform to seamlessly blend in with other major EDA tools (Virtuoso®, Custom Compiler™, Spectre/HSPICE simulators, and Calibre®/Synopsys™/Cadence® layout parasitic extractors/LPE). In fact, Lorentz™ was the first company to successfully make EM extraction as part of the LPE flow for verification with its HFD™ and PLX™ products. We are a dedicated company to advance and maintain our position at forefront of EM design and signoff platform in chiplet and 3DIC technologies for mmWave/TeraHz and AI applications.
Our History
Lorentz Solution™ Inc. was founded in 2003, and received major institutional VC investment in 2004 from Telos Venture Partners (the investment group of Cadence® Design Systems) and the WK Technology Fund. Since then, Lorentz Solution has worked closely with its key customers (including foundry customers) to deliver an EM Design Platform on an enterprise level.
Today, Lorentz Solution™ has firmly established its flagship product, PeakView®, as the industry’s ultimate EM design, verification, and structure simulation solution. It is heavily used worldwide in industry’s top wireless development companies, IDM, and foundries.
Our Team
Our inter-disciplinary team specializes in computational and applied electromagnetics, applied sciences, software engineering and EDA technology. Our personnel work collaboratively to develop a comprehensive set of tools aimed at designing and modeling high frequency on-chip passive structures.
Our Chief Executive Officer
Jinsong Zhao, founder and CEO of Lorentz Solution, Inc., received his Ph.D in Computer Engineering from the University of California at Santa Cruz, and his MSEE and BSEE degrees from Tsinghua University, Beijing, China. He holds an MBA from the University of California at Berkeley’s Haas School of Business. He has served at Bell Laboratories, and as a Senior Member of the Technical Staff at Cadence® Design Systems. Jinsong holds four U.S. patents in the area of RF modeling and module design.