PeakView®, the Ultimate 3D Fullwave EM Design and Sign-off Platform with DC-to-THz Accuracy and Scalable Capacity
— Leading EDA for device-, circuit-, and system-level EM simulation for RF/mmWave, high-speed/silicon photonics and 3DIC applications
Lorentz Solution delivers advanced electromagnetic (EM) simulation technology designed to meet the demands of today’s high-frequency semiconductor industry. PeakView® EM design platform provides a seamless and consolidated workflow to drastically simplify the challenges and complexity of today’s high frequency semiconductor designs.
Our goal is to deliver the most accurate fullwave electromagnetic (EM) simulations with 3D accuracy over a wide frequency range, all the way from DC to mmWave and TeraHz frequencies. With real 3D EM accuracy, flexible volume meshing, superior EM isolation capabilities (noise floor of -130dB), and high-capacity layout handling, PeakView® is the best tool for the EM simulation, design and sign-off/verification for analog circuits, photonic designs, and IC-Packaging layouts.
Industries We Proudly Serve
Leading the Future of Electromagnetic Simulation for Semiconductor Design
- Fullwave EM simulation breakthrough technologies with 3D accuracy
- High-performance modeling across ultra-wide frequency ranges (DC to mmWave-THz)
- Efficient handling of large and complex layouts with high-performance and high-capacity EM solvers
- Large-scale chip-Level 3D EM extraction and sign-off of ultra-high-speed designs
- Output models based on nport files or RLCK netlists with 3D field visualization for EM analysis
- EMD™– Synthesisand optimization of passive devices
- LEM™ – Full-wave EM simulation for custom layouts
- xLEM™ – EM parasitic (RLCK) extraction within RC flows
- EM Prototyping™ – EM isolation analysis for floor planning
- 3DIC/PKG™ – EM solutions for chip and packaging integration
- PLX™ – Inductance extraction for accurate parasitic modeling
- Passive device design (T-coils, inductors, transformers, couplers, co-planar waveguides, photonics transmission lines, etc)
- EM simulation large-scale layouts (coils+interconnects+ caps+metalfills+floatings) with 3D fullwave formulation
- Fullwave EM parasitic (RLCK) extraction as part of RC flow
- 3DIC and IC-Packaging solutions including advanced packaging technologies (Interposers, Wafer-On-Wafer, COUPE,etc).
- Electromigration analysis and reliability verification
- Silicon characterization based on novel de-embedding methods
- EM extraction flow for EM signoff and EM isolation simulation of ultra-high-speed and silicon photonic designs
- CLI and scripting capabilities provide a flexible foundation for users to implement their own AI-driven intelligent automation.
Our Mission
We aim to provide the most accurate, scalable, and efficient EM simulation platform—enabling engineers to design with confidence and deliver breakthrough semiconductor innovations.
As semiconductor technology evolves, Lorentz™ continues to push the boundaries of EM simulation. Our collaboration with industry leaders and participation in global technology forums demonstrate our commitment to advancing high-speed, photonic, and AI-driven applications.
Lorentz Solution Jointly Presents with NVIDIA on Large-Scale 3D Terahertz EM Simulation for Real IC/3DIC Silicon Case Studies in Photonic Switches at 2025 TSMC OIP SANTA CLARA, Calif. —(September 24, 2025) “For decades, Lorentz™ has led in EM simulation EDA, serving generations of semiconductor innovations and playing a critical role in the design ecosystem. Today represents another milestone as we continue at the forefront of the AI era.” Jinsong Zhao, CEO.
Lorentz Solution at IMS and DAC 2025 SAN FRANCISCO, Calif. —(June, 2025) Lorentz Solution™ Inc. kindly invites you to our booth #2052 at IMS and booth #1321 at DAC at Moscone West, San Francisco. Explore our latest technology breakthroughs for IC, 3DIC and Silicon EIC/PIC Photonics EM design solutions.
Lorentz Solution™ jointly Presents with Nvidia on IC/3DIC with Distributed GPU-Accelerated Photonics EM Designs at Worldwide TSMC 2024 OIP Events SANTA CLARA, Calif. —(September 25, 2024) Lorentz Solution™ Inc. announced that it is jointly presenting a paper with Nvidia at the TSMC 2024 Open Innovation Platform Ecosystem Forums around the world. The paper is titled, “Distributed and GPU-accelerated 3D EM Simulations for IC and 3DIC Photonics Applications with PeakView®.”
Lorentz™’s PeakView® 3D EM Design Platform Certified for Intel 18A Process Technology SANTA CLARA, Calif. — (February 21, 2024) Lorentz Solution™ Inc. has achieved certification on Intel 18A process technology using Intel standard golden reference data.