Semiconductor Industry’s Leader on FullWave Electromagnetic Simulations with 3D Signoff Accuracy from DC to TeraHz Frequencies
PeakView® EM design platform delivers a seamless and consolidated workflow to drastically simplify the challenges and complexity of today’s high frequency semiconductor designs. Our goal is to deliver the most accurate fullwave electromagnetic (EM) simulations with 3D accuracy over a wide frequency range, all the way from DC to mmWave and TeraHz frequencies. With real 3D EM accuracy, flexible volume meshing, superior EM isolation capabilities (noise floor of -130dB), and high-capacity layout handling, PeakView® is the best tool for the EM simulation, design and sign-off/verification for analog circuits, photonic designs, and IC-Packaging layouts.
Industries We Proudly Serve
PeakView® provides both an accurate 3D EM solver as well as a comprehensive platform that supports high-end products, necessary to guarantee your silicon success
- EMD™: EM synthesis and optimization of passive devices
- LEM™: Fullwave EM simulation of customized layouts
- HFD™: Fullwave EM parasitic (RLCK) extraction as part of RC flow
- EM Prototyping™: EM isolation study for design floor plan
- 3DIC/PKG™: EM onChip designs data + packaging incremental profile
- PLX™: EM parasitic inductance extraction as part of RC flow
- EM synthesis and optimization of passive devices (T-coils, inductors, multi-layer spirals, transformers, mmWave couplers, co-planar waveguides, photonics transmission lines, etc)
- EM signoff of large-scale circuit layouts (coils+interconnects+ caps+metalfills+floatings) with 3D fullwave EM simulations
- Fullwave EM parasitic (RLCK) extraction as part of RC flow
- 3DIC and IC-Packaging solutions including advanced packaging technologies (CoWoS, Wafer-On-Wafer and COUPE).
- Electromigration verification of complex layouts
- Silicon characterization based on top-of-the-art de-embedding methods
- EM isolation study for design floor plan with advanced layout combination capabilities.
- The most demanding silicon photonic applications
Lorentz Solution™ jointly Presents with Nvidia on IC/3DIC with Distributed GPU-Accelerated Photonics EM Designs at Worldwide TSMC 2024 OIP Events SANTA CLARA, Calif. —(September 25, 2024) Lorentz Solution™ Inc. announced that it is jointly presenting a paper with Nvidia at the TSMC 2024 Open Innovation Platform Ecosystem Forums around the world. The paper is titled, “Distributed and GPU-accelerated 3D EM Simulations for IC and 3DIC Photonics Applications with PeakView®.”
Lorentz™’s PeakView® 3D EM Design Platform Certified for Intel 18A Process Technology SANTA CLARA, Calif. — (February 21, 2024) Lorentz Solution™ Inc. has achieved certification on Intel 18A process technology using Intel standard golden reference data.
Lorentz Solution™ Joins Intel Foundry Services (IFS) Accelerator EDA Alliance Program to Enable PeakView® EM Platform and Accelerate IC and 3DIC Designs SANTA CLARA, Calif. — (February 9, 2023) Lorentz Solution™ Inc. proudly joins the Intel Foundry Services (IFS) Accelerator EDA Alliance Program to support mutual customers.