PeakView® supports multi-level IC/3DIC/Packaging EM co-sim delivering the integrated 3D fullwave EM simulation and analysis of multi-level IC, 3DIC and packaging structures with arbitrary combinations and unlimited layers. One of the typical applications is HBM+WoW+CoWos+Packaging with all the TSV and bumps. This makes the 3DIC EM design and signoff a reality by seamlessly integrating with multiple PDKs without requiring modification on any PDK.
3DIC/PKG™ Solutions
Wafer-on-Wafer (WoW) Integration
- A 3DIC architecture allows the vertical interconnection between the PIC and the EIC contributing to the high-speed, low-latency, and low-loss communication.
- After the user imports the connection file, PeakView® obtains the process information for both the CLN7 and CLN65 technologies.
- PeakView® performs an EM co-simulation of multiple process technologies in a combined environment.
IC-CoWoS Integration
- 2.5D architectures such as CoWoS also improves the horizontal interconnection of chips delivering high interconnection density compared to previous solutions.
- PeakView®’s 3DIC tool reliably integrates this technology with traditional advanced node for IC-CoWoS co-simulations.
- Accurate TSV EM modeling for backside power delivery networks and CoWoS is also supported.
- In fact, PeakView®’s combination of EM and RLCK netlist provides a comprehensive model that accounts for the coating capacitance formed by the TSV coating layer.
WoW-CoWoS Integration
- PeakView®’s powerful 3DIC integration capabilities also extends to more complex systems, where both chips and CoWoS interposers are part of the modeling domain.
- All PeakView®’s powerful EM analysis tools are also available for more complex integrations, which includes the 3D visualization of the mesh, voltage, current density, etc.
IC-Packaging Integration
- IC-PKG co-simulation is crucial when evaluating coupling effects from the package, during the simulation of routing within the PKG layers, or for signal integrity analysis of the bump connections.
- EM co-simulations of chips+packaging properly captures the induced current density produced by inductors on ground planes.
- This current density impact the performance of passive leading to degradation.
IC-PKG-PCB Integration
- PeakView®’s 3DIC/PKG™ has extended the design integration to unlimited architectures allowing the EM analysis of complete systems that may involve IC with PKG and even PCB routings.
- IC, Packaging, and PCB EM problems are intertwined due to small size and high speed. Signal integrity may be compromised without EM co-sim.
References
- LD22613_PeakView®’s EM Design Platform for Large-Scale 3DIC Systems in the New AI Era
- LD20268_PeakView EM Design on TSMC CoWoS and IC-CoWoS EM Co-Simulation
- LD19378_PeakView® Chip-Packaging-PCB EM Co-Sim
For Application Notes requests, please contact: support@lorentzsolution.com