Advanced Process Nodes

PeakView™ is process independent and supports for advanced-node IC designs for 20nm/16nm processes and beyond. It is compatible with colored mask lithography and handles layer equivalence by assigning different layer names to different layer purposes. Special boolean operations are utilized for handling lower metal layers and OD. Extra mask requirements associated with double-patterning technology (DPT) is also accounted for.

PeakView™ provides comprehensive modeling methods to enable users to model dummy metal fill with passive devices at all frequency ranges. It provides support for dielectric models for stack-ups in the latest nodes. Our current engagements include finFET-based technology placing us in the leading edge in semiconductor trends. Today, PeakView has been widely used in industry’s top semiconductor companies including the leading IC design companies and foundries.


  • Customer and Partner since 2008
  • PeakView is heavily used for RF designs and IP/process R&D
  • PeakView is qualified in the TSMC MS/RF RDK 2.0/3.0
  • TSMC EM qualification: 65nm, 40nm, 28nm, 20nm, 10nm, 7nm, 5nm, 3nm, 2nm
  • Participated in iRCX parser development
  • Ongoing advanced tech/process research projects

Intel Foundry Service

  • Customer and Partner since 2023
  • Participated in Intel’s EDA Alliance Program
  • Jointly offered technology profile support and enablement.


  • Customer and Partner
  • Participated in 28nm AMS production design flow development
  • Global foundries EM qualification: 55nm, 45nm, 28nm, 22nm, 12nm
  • PeakView is used for passive device modeling
  • Participated in ITF parser development

Samsung Foundry

  • Customer and Partner
  • Samsung EM qualification: 14nm, 10nm, 7nm, 5nm, 3nm
  • Support the common clients who are using the most advanced process nodes.


  • Customer and Partner
  • UMC EM qualification: 65nm, 55nm, 28nm, 22nm, 14nm
  • Common customer support

Vanguard, JazzTower

  • Customer and Partner

Comments are closed.