Lorentz has developed breakthrough technologies that form a powerful base for EM design and synthesis for on-chip devices and interconnect. These innovative solutions enable the next generation of DC-mmWave-TeraHertz IC & System design needs.

Accuracy, Speed and Capacity

PeakView™ 3D full-wave electromagnetic solver combines the most rigorous mathematical accuracy, minimal simulation time and enhanced computational capacity in modeling IC devices and interconnect, with no compromise on silicon correlated accuracy from DC – mmWave – TeraHz frequency range. Our state-of-the-art simulation engine typically runs 10x faster than traditional structure simulators maintaining excellent numeric precision. It is designed to efficiently analyze the complex structures found in modern semiconductor technology.


Powerful EM Synthesis & Optimization Solution

PCircuit device and interconnect design technology radically simplifies the process of managing the complexity of electromagnetic structures in advanced fabrication processes. Customized PCircuit device descriptions can be coded in a much shorter period of time than Pcells, which usually require 3-6 months. PCircuits is also typically have 100 to 500x fewer lines of code than traditionally scripted device descriptions.


3DIC & IC-Packaging Solutions

The needs for on-chip passive device and package co-simulation increase dramatically due to IC design trend in reducing the chip size, increasing the signal frequency, and stacking multiple chips in a package, even moving towards CoWOS and 3DIC. IC designers need to take into account the overall EM effects from on-chip passive devices to the package design as part of system & circuit design optimization.


Electromigration & Silicon Photonics

Electromigration is a phenomenon of material transport caused by a gradual movement of ions in a conductor due to momentum transfer between conducting electrons and diffusing metal atoms. It can lead to circuit failure through metal line resistance increase or in the extremes of the current density. While the Silicon Photonic is a CMOS based photonic platform with wide applications in different industries including telecom and datacom.

DFM Support: Chemical Mechanical Polishing (CMP)

PeakView™ Chemical Mechanical Polishing (CMP) provides full support for advanced process node DFM requirements during EM synthesis and Layout EM extraction. Designers are able to define their own metal fill and slotting requirements in a PCircuit description. During EM synthesis, these rules are considered and PeakView™ delivers a DRC clean layout with accurate EM and circuit simulation models.


Cadence Virtuoso & Custom Compiler Integration

PeakView™ is a full-wave, 3D electromagnetic design platform working directly from within the popular IC design environments. Its interactive GUI is seamlessly integrated with the Cadence® Virtuoso® and Custom Compiler™ layout editors.


Advanced Process Nodes

PeakView™ is process independent and supports for advanced-node IC designs for 20nm/16nm processes and beyond. It is compatible with colored mask lithography and handles layer equivalence by assigning different layer names to different layer purposes. Special boolean operations are utilized for handling lower metal layers and OD. Extra mask requirements associated with double-patterning technology (DPT) is also accounted for.


Silicon Characterization

For RF designs, EM simulations become indispensable. Typical Foundry Silicon Characterization has their limitations. From test key design, test key manufacturing, measurement to de-embedding, almost all manual work, long cycle, and hard to add new devices for different apps/frequencies. Uncertainty exists in the de-embedded results and de-embedding method. Limited silicon data reference leads to uncertainty in EM design. Peakview-based Rapid Silicon Characterization approach provides a fast turnaround to support customer requirements, including software and simulation based flow. High-quality silicon data with a quantified error margin of inherent methods are used and compared. Reliable correlation with process information and EM simulations enables customer satisfactions.


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