PeakView™ products are seamlessly integrated into advanced process nodes from mainstream foundries and facilitate different phases of IC design and verification. The state-of-the-art technology simplifies the process of complex system-level EM design, and provides unique sign-off tools bench-marked for physical verification.

PeakView EMD™  EM Synthesis and Analysis – PeakView EMD™ provides parametric EM device synthesis and analysis of sophisticated on-chip passive devices and structures. EMD™ has an extensive synthesis library of parameterized devices that include inductors, transformers, baluns, transmission lines, MIM and MOM capacitors, finger capacitors and other commonly used topologies. In addition to a comprehensive standard library, users have the flexibility to script customized PCircuits tailored to meet their specific design requirements. Designers work with a powerful user interface allowing EMD™ to eliminate the manual steps of drawing devices by hand. EMD™ further automates the design process with options to synthesize target values and sweep design parameters for optimum performance.  (brochure)

PeakView LEM™ – EM Extraction and Modeling – PeakView’s LEM™ extraction solution provides fast, easy to use, single-click EM simulation from within Virtuoso® and Laker™ layout editors. Passive structures and interconnect are automatically extracted for a full wave, 3D electromagnetic analysis. PeakView’s high-capacity engine supports complex multi-port structures and swiftly creates accurate EM models with necessary design library views. (brochure)

PeakView HFD™ – EM Interconnect Design Analysis – PeakView HFD™ is an electromagnetic and parasitic inductance extraction tool for evaluating the electromagnetic behavior of critical signal paths in high-speed designs. At microwave and millimeter wave frequencies, as physical lengths of interconnect approach their wave-lengths, inductive and associated skin loss effects begin to predominate and noticeably impact circuit performance. To address this concern, HFD™ enhances traditional LPE (Layout Parasitic Extraction) capabilities by including electromagnetic effects into LPE generated results. With HFD™, users are able to select critical high frequency signal nets in either the schematic or layout views of their designs. PeakView™ electromagnetically analyzes the corresponding interconnect geometry and reconnects the EM model to the post-layout simulation net-lists output by conventional RC extraction tools. (brochure)

PKG/PCB™ – Package and Board-level Analysis – PKG/PCB™ is a utility equipped for IC, package and board-level electromagnetic coupling analysis. The feature expands the application of PeakView LEM™ to include package and PCB signal integrity analysis. This feature provides an efficient solution to address EM design challenges concerning chip-to-board and chip-to-package interactions. (brochure)


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