Our University Program is dedicated to supporting engineering education and research with our innovative technology. The program is open to universities around the world. We provide academic pricing and encourage research groups to take advantage of our electromagnetic design and verification solutions.
We are currently supporting sophisticated IC design projects operating at RF, millimeter-waves and THz frequencies at our affiliated university partners’ laboratories.
It is an honor to provide our technology to the researchers working at the academic forefront. We are grateful to be acknowledged in publications where simulation results are produced by PeakViewTM.
Our leading academic partners include:
UC Berkeley Wireless Research Center (BWRC)
UC Berkeley BWRC is at the forefront of wireless research. The team designs and implements highly-integrated mm-wave transceivers using conventional silicon technology. The PeakViewTM suite is a part of the EDA tool flow that provides mm-wave passive device and interconnect EM analysis on foundry PDKs.
UCLA High Speed Electronics Laboratory
The High Speed Electronics Laboratory is currently working on the projects on Terahertz (300-600GHz) CMOS Circuits and System-on-Chip including frequency synthesizer, radiator, spectrometer for communication, radar and imaging system applications, CMOS System-on-chip for satellite, space science and astrophysics instrumentation applications, etc. PeakView is an essential part of the EM synthesis, optimization and simulation toolset for mmWave/Terahertz design and research.
Shanghai Jiao Tong University
PeakViewTM is used to investigate building blocks and peripheral circuits for 60GHz transceiver projects at Shanghai Jiao Tong University, China. Major application areas of our tools are 60GHz transmission lines, inductors, low-voltage, low-power VCOs, LNAs and PCB design for high speed IO.
- Lorentz Solution and Stanford researchers jointly presented a paper at 2012 TSMC Open Innovation Platform® (OIP) Ecosystem Forum in Silicon Valley. The paper received TSMC’s Customer Choice Award selected by the attendees. The paper was focused on electromagnetic modeling of critical interconnect in millimeter wavelength (MMW) designs from 50 to 70 GHz.
- Stanford researchers published an ISSCC article this year where PeakViewTM simulation results were acknowledged.
Tsinghua University Microelectronics Department conducts cutting-edge research in the area of RF and THz CMOS designs (up to 300GHz). Lorentz Solution is in a multi-year partnership with the University to enable quality EM synthesis, optimization and analysis for their leading projects.
University of Michigan
A prominent research group in University of Michigan is applying PeakView™ in analog and mixed-signal circuits, analog-to-digital conversion, and other interface circuits. Applications include high-speed serial transceivers, RF transceivers and sensors. The main focus of this group is on circuits that transfer information between the analog and digital domains.
Institute of Microelectronics, Chinese Academy of Sciences (IMECAS)
Institute of Microelectronics, Chinese Academy of Sciences (IMECAS) Radio Frequency Integrated Circuit Department focuses on Radio Frequency and Millimeter Wave Integrated circuit based on Silicon technology. PeakViewTM EM platform provides comprehensive solution for addressing passive devices design productivity and accuracy challenges.
Southern Methodist University
The research group in the Department of Physics at SMU is a member of the ATLAS (www.atlas.ch) collaboration. This group is responsible for developing the next generation of optical links for future particle physics experiments. They are designing ASICs (serializer and VCSEL array driver) as well as systems, where custom inductor design plays a vital role in the wide-band ASIC developments. PeakView is the key EDA tool used in optimizing those special EM devices.
Khalifa Semiconductor Research Center (KSRC) is a multidisciplinary research center based at Khalifa University’s Abu Dhabi campus. Established in 2011, this center is actively conducting research in areas such as wireless RF, Digital System-on-Chip (SoCs), semiconductor technology, biomedical engineering, aerospace, etc. This center is also leading member of ACE4s (http://www.src.org/program/grc/ace4s/) collaboration.
National Chiao Tung University
National Chiao Tung University (NCTU) mmWave Intelligent Radar Research Center aims to develop next-generation full-integrated mmWave intelligent systems using advanced CMOS technologies. Lorentz Solution PeakView is adopted by the NCTU research team to quickly and effectively investigate the performances of various passive device structures to enable the first silicon success.
Fudan University School of Microelectronics has focused research on mixed signal and RF ICs, as well as wireless systems. EM tools from Lorentz Solution help to improve design quality and speed up design procedures on sensitive high frequency CMOS building blocks, such as VCO, PAs, LNAs, etc. It also provides solid verification solutions for wireless SoC.
University of California, Davis (UC Davis)
The Davis Advanced RF Technologies lab (http://dart.ece.ucdavis.edu/) is investigating various aspects of high frequency electronic devices, circuits, and systems. Examples include reconfigurable high frequency devices and components, high frequency integrated circuits, high frequency communication and radar systems and their application in biomedical, societal, and environmental applications. We use PeakView to expedite the design of on-chip passives for RF, microwave, and millimeter-wave frequencies.
Case Western Reserve University
Case Western Reserve University has focused research on high-performance RF/mm-wave integrated circuits and systems for 5G and IoT applications, Low power interface circuits for MEMS and sensors. EM tools from Lorentz Solution help to improve design quality and speed up design procedures on sensitive wireless SoC design.
University of Washington
The Fast Lab of the University if Washington focus on the topics related to and log, mixed-signal, RF and mm-wave circuits. The PeakView is used in a newly developed 60GHz mm-wave CMOS transceiver design.
Seoul National University
Integrated System Design Lab (ISDL) Department of Electrical and Computer Engineering, Seoul National University has interests in high-speed wireline interface. The major fields of research are high-speed wireline transceiver, PLL, and optical transceiver. PeakView can be used to design high-Q LC oscillators for PLL and CDR, inductor and T-coil for interface front-end, and modeling of RDL/Package interconnect.
The nifty chips laboratory (niftylab.github.io) at Hanyang University is working on various high-speed electronics research projects including ultra-high-speed wireline and clock generation circuits. PeakView is playing a central role in capturing characteristics of various EM devices including inductors and t-coils.
Benefits of University Program Partners
- We are dedicated to academic progress. The purpose of the University Program is to equip research groups with the most recent technology, offer students the opportunity to explore novel ideas and provide engineering solutions for next generation IC specialists.
- Our solutions ensure high-fidelity simulation results closely correlating to silicon measurements, paving the way to publications in journals and conferences.
- Adoption of Lorentz scientific software in laboratories can be done through a convenient, process, since PDKs (Process Development Kits) from all major foundries and interfaces with contemporary EDA (Electronic Design Automation) tools are supported.
- Our academic policy welcomes accredited universities and their affiliated research laboratories with a demonstrable interest in high frequency IC design/verification to participate.
How to Apply
To participate in the program, feel free to contact us at email@example.com. Please provide a brief description of current projects or the curriculum where the tool is intended for use. We’ll provide you with a quote (to cover modest administration and support costs), terms and agreement documentation.