Patents and Publications

PeakView™ is based on patented techniques for the fast, accurate fullwave 3D simulation of electromagnetic structures.

“Electromagnetic Simulator Systems and Methods”

Author: Zhao, J. – U.S. Patent Number: 7,562,000
Click here to read the full patent.

“Methods for Integrated Circuit Analysis”

Author: Han, Y. and Zhao, J. – U.S. Patent Number: 9,305,124

Click here to read the full patent.

Recent Publications

  •  Youngae Han; Jinsong Zhao, “Accurate Substrate Analysis Based on a Novel Finite Difference Method via Synchronization Method on Layered and Adaptive Meshing,” Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on, vol.32, no.10, pp.1520,1532, Oct. 2013
  • Youngae Han; Jinsong Zhao, “A Novel High-Capacity Electromagnetic Compression Technique Based on a Direct Matrix Solution,” Advanced Packaging, IEEE Transactions on , vol.33, no.4, pp.787,793, Nov. 2010

Product Acknowledgements/PeakView Contributions


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