September 26, San Jose Convention Center, CA
We are excited to be a part of the TSMC Open Innovation Platform Ecosystem Forum in San Jose, CA. We will provide comprehensive information on how PeakView™ can assist you to achieve the best efficiency for your design goals and meet specifications for microwave, millimeter-wave and THz applications. We will also cover integration of PeakView™ full-wave electromagnetic simulation results into your extraction and SPICE flows. This year, we have been able to achieve radical improvement in the performance of our core EM engine and interconnect parasitic inductance extraction methodology at high frequencies.
PeakView™ is used by leading RF companies and wireless transceiver industries for ultra-high-frequency design and verification. Visit our booth (#419) at the OIP 2019 and learn more about our RF, MW and MMW solutions.
October 24, Kerry Hotel Shanghai (New Pudong), China
With the era of 5G, artificial intelligence and autonomous vehicles now upon us, this year’s event will give you the opportunity to gain additional insights about how our latest solutions are helping bring new generations of products to life across these markets and more, including:
Mobile & Wireless Infrastructure
Computing & Wired Infrastructure
Automotive, Industrial & Multi-Market
We are looking forward to GTC_Shanghai (booth#115) this year.
June 03 – 05, Las Vegas Convention Center, Las Vegas, NV
EDA (Electronics Design Automation) is becoming ever more important with the continuous scaling of semiconductor devices and the growing complexities of their use in circuits and systems. Demands for lower-power, higher-reliability and more agile electronic systems raise new challenges to both design and design automation of such systems. For the past five decades, the primary focus of research track at DAC has been to showcase leading-edge research and practice in tools and methodologies for the design of circuits and systems.
In addition to the traditional EDA topics ranges from physical design to system architectures, DAC features high-quality papers on design research, design practices, and design automation for cross-cutting topics including low-power, reliability, multicore/application specific/heterogeneous architectures, 3-D integrations, emerging device technologies, design automation of “things”, and their applications. DAC’s EDA technical program has been ensuring the best-in-class solutions that promise to advance EDA.
You are cordially invited to drop by our booth (#528) and learn more about why PeakView™ has emerged as the best quality EM tool for addressing most demanding of design challenges in the IC sector.
June 04 – 06, Boston Convention and Exhibition Center in Boston, Massachusetts
The International Microwave Symposium (IMS) is the centerpiece of the Microwave Week technical program, which includes the Radio Frequency Integrated Circuits Symposium (RFIC) and the Automatic Radio-Frequency Techniques Group Conference (ARFTG). With over 9,000 participants and 1,000 industrial exhibits of state-of-the-art microwave products, IMS Microwave Week is the world’s largest gathering of Radio Frequency (RF) and microwave professionals and the most important forum for the latest research advances and practices in the field.
We are looking forward to IMS (booth#219) this year. There are new challenges facing engineers as their designs need to work faster and meet tighter specs with the lowest possible power. PeakView helps provide an answer to these challenges.