LEM™ implements PeakView®’s 3D fullwave EM solver to deliver a comprehensive and unique model of customized layouts that can be loaded from conventional design environment such as Virtuoso, CustomCompiler™ and any environment that exports GDS files. PeakView® implements effective volume meshing techniques such as full 3D mesh as well as multi-sheet current to model both horizontal and vertical current distribution, which accounts for vertical inductance phenomenon. FlatLEM, as unique direct solver, provides the best accuracy without port limitation handling more than 10,000 ports while our iterative high capacity solver (HCS) handles large-scale simulations with million number of unknowns (full-chip simulations, brute-force metalfills extraction, IC-PKG co-sim, etc.).
LEM™ Provides 3D FullWave EM Simulation of Customized Layouts for Design Signoff
- Accuracy, Performance and Capacity: PeakView®’s patented EM solver combines high accuracy, computational performance and capacity to simulate complex layouts with devices, interconnects, packaging and 3D-IC interfaces.
- 3D Signoff accuracy for fullwave EM simulations over DC-mmWave-THz frequencies
- Direct FlatLEM solver with no port number limitation handling >10,000 ports
- Iterative HCS solver to handle large-scale simulations with >1Million unknowns
- EM Isolation noise floor up to -130dB
- Flexible Meshing Setup for full-chip large-scale simulations
- Support for Advanced Process Nodes and Technology: PeakView®’s iRCX and ITF Parsers simplify importing PDK layer process information into the tool. LEM™ support for advanced process nodes from 65nm to 2nm PDKs.
- Design Flow Integration: LEM™ is seamlessly integrated into the Virtuoso® and CustomCompiler™ layout editors with a bi-directional, lossless data exchange interface. Designers are able utilize the tool in their familiar IC design environment.
- Automates Layout Processing: PeakView® automatically processes complex designs and generates corresponding layouts for EM simulation. Users are not required to make any modification (e.g. simplifying via, metal fill etc.) to their designs.
- Advanced EM Results Analysis: Users can probe any formula based on S-, Y- or Z-parameters within PeakView®. EM results post-processing is also available to analyze layouts under different conditions (common-mode, differential excitation, etc). Field visualization (3D mesh, voltage, current density, etc) provides a new level of layout performance analysis.
LEM™ Flow

LEM™ High-Performance EM Simulation Features
- Flexible Meshing Setup: PeakView® provides several levels of mesh customization allowing the users to specify special meshing techniques depending on the device or application. This boost the simulation capacity with a focalized mesh accuracy.
- Process Corner and Temperature Coefficient Modeling: PeakView® generates S-parameter and lumped models that account for process corners and temperature sweeps. Models can be utilized within popular simulation environments such as ADE-XL.
- Revolutionary EM Solver Technology: Quick EM technology drastically boosts simulation performance without the loss of accuracy.
- Support for DFM Requirements such as Metalfills and Slotting: LEM™ addresses sub-40nm challenges in advanced processes with the PeakView® chemical-mechanical polishing (CMP) option (complex metal slotting, striping, via arrays, and metalfills).
- Multi-core Processing and Distributed Computing: PeakView® provides different distributed computing modes to concurrently accelerate the EM modeling. Users are able to specify different frequency points to be simulated on different machines in a compute farm for maximum efficiency of resources.


- Physics-Based Modeling (PBM) and Hierarchical PBM (HPBM): LEM™ also generates compact RLCK models called Physics-Based Models (PBM) that guarantee passivity and physical realizability. PeakView® HPBM addresses complicated structures, where users can specify different PBM methods for each sub-component.

LEM™ Supported Formats
- LEM Setup
- iRCX format technology file from TSMC
- ITF format technology file from foundries
- LEM Input
- Virtuoso® or Custom Compiler™ layout with pins
- GDSII Layout
- ODB++ Import
- LEM Output
- n-port, Physics-Based EM models.
- Model views added to Cadence® Library
- Platform
- Linux 64 bit, i.e. Redhat and SUSE
- LSF, NC -based computing farm