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PeakView CMP Improves Design Manufacturability
Chemical-mechanical polishing (CMP) requirements, such as, wide metal slotting and metal fill have been required for most advanced (sub-130nm) process nodes for awhile. However, for many large EM structures like inductors, baluns, and transformers, creating the layout manually and enforcing these CMP rules has proven to be very difficult and usually negatively impacts device performance. Furthermore, accurate EM and subcircuit models have not been available because general purpose EM solvers have been unable to handle the additional complexity introduced by the metal fill. In addition, complex wide metal slotting, staggered slotting/striping and via handling during manual has emerged as a time-consuming, error-prone design process that ends up being too difficult for general purpose EM solvers to accurately model. Most design teams end up requesting design waivers for these structures in order to pass final-signoff to manufacturing. But this approach is no longer acceptable due to the adverse impact yield and moving to 65nm technologies and below will only exacerbate this problem. What is needed is a new approach!
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