Accuracy, Speed and Capacity

Overview

PeakView™ electromagnetic solver combines mathematical accuracy, minimal simulation time and enhanced computational capacity in modeling IC devices and interconnect. Our state-of-the-art simulation engine typically runs 10x faster than traditional structure simulators maintaining excellent numeric precision. It is designed to efficiently analyze the complex structures found in modern semiconductor technology.

Accuracy

PeakView™ engine is meticulous in meshing asymmetric and non-rectilinear geometry. Smart meshing strategies are used to optimize computation time and preserve high accuracy taking into account process and design requirements. For example, tall side-walls of advanced process nodes are analyzed with precise sidewall meshing. Skin effects at high frequencies are accounted for with special meshing algorithms that consider current density. Thick metal layers, e.g. AP, are uniquely treated for high quality EM results.

PeakView™’s Method-of-Moments-based field solver is tested for numerical accuracy using rigorous meshing densities at frequencies above millimeter-wavelengths (beyond 80 GHz), and as low as in the MHz range. Our numerical methods are accurate to 4 decimal places and we have been able to achieve 80dB SNR in isolation studies.  Physical effects associated with dielectric layers, Epi and SOI substrates are correctly modeled in PeakView™. It allows for easy handling of process corners and temperature coefficients. Our EM solver accuracy has been consistently demonstrated in tape outs, test chips and silicon correlation studies.

Speed

PeakView™ is a very fast, multi-threaded EM solver that employs multi-core processors and is able to run simultaneous simulations on different cells. The increase in speed with the number of cores is almost linear with its use of the multi-threading option.

Capacity

In order to maximize utilization of computational resources, PeakView™ not only uses multi-core processing capability on standalone servers, but is able to run design jobs on computing farms consisting of multi-core machines as well. In addition to making use of platform load sharing capacity (LSF), our Hierarchical EM (HEM) solution significantly reduces memory requirement and dramatically shortens the CPU time without compromising accuracy.

 

Comments are closed