Advanced Process Nodes

PeakView™ provides complete support for advanced-node IC designs for 20nm/16nm processes and beyond. It is compatible with colored mask lithography and handles layer equivalence by assigning different layer names to different layer purposes. Special boolean operations are utilized for handling lower metal layers and OD. Extra mask requirements associated with double-patterning technology (DPT) is also accounted for.

PeakView™ provides comprehensive modeling methods to enable users to model dummy metal fill with passive devices at all frequency ranges. It provides support for dielectric models for stack-ups in the latest nodes. Our current engagements include finFET-based technology placing us in the leading edge in semiconductor trends.

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