News

Lorentz Solution, Inc. and Stanford University Receive Customer Choice Award for TSMC 2012 OIP Ecosystem Forum Paper on Electromagnetic Design for Silicon Millimeterwave IC

SANTA CLARA, Calif. — (February 21, 2013) — Lorentz Solution, Inc., the world’s leading provider of Electromagnetic (EM) Design Platform Solutions for RF and High Speed Integrated Circuit (IC) Design, received TSMC’s Customer Choice Award for its paper presented at the 2012 TSMC Open Innovation Platform® (OIP) Ecosystem Forum in Silicon Valley. The paper was co-authored with Stanford University and focused on electromagnetic modeling of critical interconnect in millimeter wavelength (MMW) designs.

Lorentz Solution to Jointly Present with Stanford University at the TSMC 2012 OIP Ecosystem Forum on EM Design for Silicon Millimeter-wave IC

SANTA CLARA, Calif. — Oct 12, 2012Lorentz Solution, Inc., the world’s leading provider of Electromagnetic (EM) Design Platform Solutions for RF and High Speed Integrated Circuit Designs, today announced that it is presenting a paper jointly with Stanford University at the upcoming TSMC 2012 Open Innovation Platform Ecosystem Forum. The paper presents a millimeter-wave distributed phase shifter designed with the use of PeakView High Frequency Designer (HFD). At these operating speeds electromagnetic effects are critical for devices and also for interconnect. More…

Lorentz Solution’s PeakView Supports TSMC RF Reference Design Kit 3.0

SANTA CLARA, Calif. — June 1, 2011 — Lorentz Solution, Inc., the world’s leading provider of Electromagnetic (EM) Design Platform Solutions for RF and High Speed Integrated Circuit Designs, today announced that PeakView® EM solution for Chemical and Mechanical Polishing (CMP) has been included in TSMC’s 65 nanometer RF Reference Design Kit RDK 3.0. The PeakView CMP-Enabled EM solution provides device synthesis, simulation, extraction and modeling to the RDK for RF and AMS designs that demand the highest performance like the RDK’s 60 GHz reference design completed in TSMC’s 65nm design infrastructure. More…

Lorentz Solution Collaborates with Cadence to Enhance RFIC Design Solutions

SANTA CLARA, Calif. — June 1, 2011 — Lorentz Solution, Inc., the industry-leading provider of Electromagnetic (EM) design solutions for RF and high speed integrated circuits, today announced a joint marketing agreement (JMA) with Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, aimed at providing more tightly integrated solutions for RFIC and high-speed analog designers. More…

Lorentz Solution’s Peakview EM Design Platform Utilized by Altera to Address High Speed Design Challenges

SANTA CLARA, Calif. — February 16, 2011 — Lorentz Solution, Inc., the world leading provider of Electromagnetic (EM) Design Platform Solution for RF and High Speed Integrated Circuit (IC) Designs, today announced Altera Corporation (Nasdaq: ALTR) has added PeakView CMP capability to its existing PeakView EM Design Platform solution. With PeakView CMP capability added to the device modeling flow, passive device performance can now be effectively analyzed with advanced process constraints for various metal fill and slotting/striping patterns. With a complete PeakView EM Design Platform, Altera is able to automate the passive device modeling process from synthesis to simulation model generation with design constraints to meet stringent performance target. More…

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